ENVIRONMENTAL SPECIFICATION |
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RoHS Compliance: RoHS compliant and Pb (lead) free |
Moisture Sensitivity Level: Level 1 (Infinite) |
Second Level Interconnect: e4 |
Storage Temperature Range: -55° to +125°C |
Humidity: 85% RH, 85°C for 48 hours |
Fine Leak / Gross Leak: MIL-STD-883, meth. 1014, cond. A MIL-STD-883, meth. 1014, cond. C |
Hermetic Seal: Leak Rate 2x10-8 ATM-cm3/s max |
x. Solderability: MIL-STD-2002F method 208E |
Reflow: 260° for 10 seconds x2 |
Vibration: MIL-STD-202F method 204, 35g, 50Hz to 2000Hz |
Shock: MIL-STD-202F method 213B, test condition: E, 1000g ½ sine wave |
Resistance to Solvents: MIL-STD-202, Method 215 |
Temperature Cycling: MIL-STD-883, Method 1010 |
ESD Rating: >2000V (per MIL-STD-883, method 3015) |
Pad Surface Finish: Gold (0.3um min.) over nickel (1.27um to 8.89um) |
Weight of the Device: 0.09 grams. |