| ENVIRONMENTAL SPECIFICATION |
|---|
| RoHS Compliance: RoHS compliant and Pb (lead) free |
| Moisture Sensitivity Level: Level 1 (Infinite) |
| Second Level Interconnect: e4 |
| Storage Temperature Range: -55° to +125°C |
| Humidity: 85% RH, 85°C for 48 hours |
| Fine Leak / Gross Leak: MIL-STD-883, meth. 1014, cond. A MIL-STD-883, meth. 1014, cond. C |
| Hermetic Seal: Leak Rate 2x10-8 ATM-cm3/s max. |
| Solderability: MIL-STD-2002F method 208E |
| 208E Reflow: 260° for 10 seconds x2 |
| Vibration: MIL-STD-202F method 204, 35g, 50Hz to 2000Hz |
| Shock: MIL-STD-202F method 213B, test condition: E, 1000g ½ sine wave |
| Resistance to Solvents: MIL-STD-202, Method 215 |
| Temperature Cycling: MIL-STD-883, Method 1010 |
| ESD Rating: >2000V (per MIL-STD-883, method 3015) |
| Pad Surface Finish: Gold (0.3um min.) over nickel (1.27um to 8.89um) |
| Weight of the Device: 0.17 grams. |